Using highly developed recipes, Mir Enterprises offers deep silicon etching of high aspect ratio features (1:30+), whilst retaining good sidewall...

Wafer Level Packaging of MEMS sensors enables high yield, high volume and facilitates device functionality where specific pressure or gases...

Mir Enterprises will be attending the 34th IEEE Internation Conference on Micro Electro Mechanical Systems (25-29 January 2021). The event...

We will continue to service our clients uninterrupted throughout the COVID pandemic period. We expect our lead-times to remain as...

Mir Enterprises has developed and manufactured its next generation of MEMS wafer-level-packaged gyroscopes on a triple-stack-configuration platform. These sensors can...

Making use of production grade and volume compatible tools such as the ASML 5500B i-line stepper lithography (with double sided...

SEMICON Europa will co-locate with productronica for the first time, for a focus on innovation and the future of the...

05.04.2016 These high performance inertial sensors will serve a variety of industries. At the core of the sensor lies an...