MEMS Wafer Level Packaging (WLP)
1st October 2020
Mir Enterprises will be attending SEMICON Europa 2023
14th April 2023

Deep Reactive Ion Etching (DRIE) with High Aspect Ratios

Using highly developed recipes, Mir Enterprises offers deep silicon etching of high aspect ratio features (1:30+), whilst retaining good sidewall angels, for an array of MEMS technologies, including C-SOI platform. For each design, the recipe is fine tuned in order to obtain geometries for critical features as close to the nominal values as possible.