MEMS Wafer Level Packaging (WLP)
1st October 2020
Mir Enterprises will be attending SEMICON Europa 2023
14th April 2023
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Deep Reactive Ion Etching (DRIE) with High Aspect Ratios

Using highly developed recipes, Mir Enterprises offers deep silicon etching of high aspect ratio features (1:30+), whilst retaining good sidewall angels, for an array of MEMS technologies, including C-SOI platform. For each design, the recipe is fine tuned in order to obtain geometries for critical features as close to the nominal values as possible.