Mir Enterprises will be attending the IEEE MEMS 2021 Online
6th September 2020
Deep Reactive Ion Etching (DRIE) with High Aspect Ratios
15th July 2021

MEMS Wafer Level Packaging (WLP)

Wafer Level Packaging of MEMS sensors enables high yield, high volume and facilitates device functionality where specific pressure or gases are required inside the sealed cavity. Mir Enterprises has years of experience in packaging of such MEMS devices (both for inertial sensors and micro-fluidic devices), using direct, anodic, thermocompression and eutectic bonding techniques. For more support and list of services, please contact our team. You will find the details in the “Contact Us” section.