Volume and production grade lithography and etching capability, down to 0.5um MFS and better than 100nm overlay
11th October 2017Mir Enterprises operations continue as normal throughout the COVID pandemic.
20th June 2020Next generation of MEMS angular rate sensors
Mir Enterprises has developed and manufactured its next generation of MEMS wafer-level-packaged gyroscopes on a triple-stack-configuration platform. These sensors can be designed bespoke to meet the specifications and requirements of a given application and/or market. For more information please get in touch. You will find our details on the “Contact Us” page.
Triple stack Wafer-Level-Packaged MEMS die
