Services

Below is a list of some of the services we offer. For our complete range please give us a call and one of our process integration engineers will be glad to help you.

Lithography

  • Contact printing, single and double sided. min resolution of 2um
  • Stepper Lithography, min resolution 480nm
  • Direct write (E-Beam), min resolution down to 20nm
  • Robotic wafer handling for optimum yield
  • Spray coating technology for high topology surfaces

He-ion FIB sub nano imaging and milling

  • Carl Zeiss NanoVision N40 below 0.9nm resolution

Nano Imprinting Technology

  • Nano stamping and patterning down to 50nm resolution

Dry etching

  • RIE
  • DRIE, Advanced Silicon Etch using Bosch process
  • Ion Beam Milling

Implantation

  • upto 750keV with an extensive range of targets Growth, diffusion and wet processing
  • Extensive range of furnaces from standard anneal to high quality gate oxides
  • Full wet processing line

Deposition

  • Sputtering and Electron beam evaporation with various targets
  • PECVD Silicon nitride, silicon oxide and TEOS
  • Low Pressure CVD silicon nitride and poly/amorphous silicon reactors

Metrology and Characterisation

  • FESEM down to 1nm resolution
  • SEM with X-ray fluorescence analysis
  • SEM with high resolution 2D and 3D X-ray imaging of internal structures of samples
  • SEM with fluorescence imaging spectrometer for sub-100nm spatial resolution imaging
  • AFM and high resolution cryogenic Scanning Probe Microscope (SPM) with TERS
  • Ellipsometer, profilometer, thin film, stress measurement tools
  • Microscope for wide field and confocal imaging with 405nm laser for writing
  • BioMEMS microscope with up to 150x objectives
  • Spectral analysis microscope with fibre coupling unit connecting to a photospectrometer

Measurement tools

  • Stress, dektak and four point probe measurement tools
  • 3D modelling and Rapid Prototyping
  • Design, modelling of 3D structures and prototyping using resin down to 0.1mm resolutions

Dicing and bonding

  • Wafer sawing/dicing, gold wire bonding and packaging

Miscellaneous

  • Electrophoretic coating for extreme MEMS technology

Cant find it?

Give us a call or send an email and we will get back to you very soon with help…

Contact us